Standard

Standard

Number: Standard
Price on quote
Quantity

Specifications

Number
Standard
TAG 1
4,25"
TAG 2
CMP Process ILD, CMP Process STI, CMP Process Metal
TAG 3
SST - Diamond-Nickel Bonding
Brand

Documentation

CMP Pad Conditioners SPS-Europe Sheet

Reviews

Product description

Standard PAD CONDITIONER

Pad-refreshing consumable for removal of polyurethane pad surface clogging
4.25" (Stainless Steel, Diamond-Nickel Bonding)

Our CMP Pad Conditioners have been tested and proven in production by major semiconductor manufactures in USA, Europe, Taiwan and Korea. We have the capability to meet the needs of each customer by providing customized disks. Our CMP disks are available in various production quantities, shapes and sizes for all CMP production platforms.

Application:

 

  • Semiconductor CMP process (ILD, STI, Metal, TSV, Buffing, Barrier, Poly, Gate)


Features

 

 

  • Stable Pad Roughness
  • Long conditioner life time