PROCESS ALUMINUM CASSETTE BI-PITCH 13 SLOT FLAT SLOT -/thick wafers 100 mm (4") with Handle

Applications:

• Process Equipment - Thermal processes environments where the wafer is processed in the cassette above 43° C (110° F), the typical structural threshold upper limit of plastic process cassettes.  This includes chemical vapor deposition (CVD), rapid thermal processing (RTP) and wafer annealing applications.
• Bake - Long term thermal bake applications where wafers are left in ovens for multiple days.
• High wafer insertion temperatures - Process equipment where wafer insertion temperatures (wafers coming out from the process tool) exceed the melting point of a plastic cassette.  The need for higher throughput reduces the amount of time the wafers are left inside the chamber to cool and acclimate. 
• Internal environment cassette - Cluster tool automation environments where a cassette is idle inside a heated vacuum environment (chamber) for multiple process steps.
• Precision carrier requirements - Moderate-thermal automation environments where there is a need for dimensional precision that a plastic cassette cannot offer.
• Thin Wafer Handling - Thin wafer handling where sharp thin wafers cut into plastic cassettes.
• Thick Wafers - Bonded or thick wafer applications where industry standard plastic cassettes will not work due to slot dimensions.

The M1 series is an all aluminum 100 mm (4”) 13-slot metal cassette for processing semiconductor wafers in a thermal environment, up to 350° C. A SEMI compliant cassette with outside dimensions and 8° angular slots similar to an industry standard plastic cassette for easy integration into stage and transfer automation considerations.  All aluminum surfaces are (HC) hard clear anodized for prolonged abrasion resistance. ISO 3, FS209E Class 1.