SYSKEY TECHNOLOGY Co., Ltd.
Multi-Layer Sputter
SYSKEY TECHNOLOGY Co., Ltd.
Multi-Layer Sputter
Excellent thin-film uniformity of less than ±3%.
Substrate holder heating up to 600°C
Shutters are installed each sputtering source and substrate
The high-quality multilayer films are becoming increasingly important in precision systems that single material thin film cannot practice the required specifications.
Applications
- Intergrated with Load-Lock, robot arm, glove box.
- Combined with Ion-source, Thermal source, E-beam, etc.
- RF or DC bias switching.
- Thickness monitor.
- Substrate RF plasma cleaning.
- Extra spare port for OES, RGA or extra process monitoring.
Configurations
- Flexible substrate size up to 12 inch.
- Excellent thin-film uniformity of less than ±3%.
- Magnetron sputtering sources (up to 6 sources) with optional target sizes.
- RF, DC or pulsed-DC for non-conductive or conductive target.
- Deposition of multilayer films with selected target materials.
- Mass flow controllers (up to 4 gas lines).
- Substrate holder heating up to 600°C.
- Adjustable substrate to target spacing.
- Shutters are installed each sputtering source and substrate.
Chamber
- Flexible chamber sizes depend on substrate size and applications.
- Full-width opening door integrated two viewports with shutters for observing substrate and sputter sources.
- Full range vacuum gauge with display and Baratron gauge for closed-loop pressure control.
- Ultimate vacuum of chamber about 10-8 Torr.
Options
- Intergrated with Load-Lock, robot arm, glove box.
- Combined with Ion-source, thermal source, E-beam, etc.
- RF or DC bias switching.
- Thickness monitor.
- Substrate RF plasma cleaning.
- Extra spare port for OES, RGA or extra process monitoring.
Brand
SYSKEY TECHNOLOGY Co., Ltd.
Product Number
Multi-Layer-Sputter-Sys
Size
up to 12 inch
Status
Request information