Multi-Layer Sputter

The high-quality multilayer films are becoming increasingly important in precision systems that single material thin film cannot practice the required specifications.

Applications

• Intergrated with Load-Lock, robot arm, glove box.
• Combined with Ion-source, Thermal source, E-beam, etc.
• RF or DC bias switching.
• Thickness monitor.
• Substrate RF plasma cleaning.
• Extra spare port for OES, RGA or extra process monitoring.

Configurations

• Flexible substrate size up to 12 inch.
• Excellent thin-film uniformity of less than ±3%.
• Magnetron sputtering sources (up to 6 sources) with optional target sizes.
• RF, DC or pulsed-DC for non-conductive or conductive target.
• Deposition of multilayer films with selected target materials.
• Mass flow controllers (up to 4 gas lines).
• Substrate holder heating up to 600°C.
• Adjustable substrate to target spacing.
• Shutters are installed each sputtering source and substrate.

Chamber

• Flexible chamber sizes depend on substrate size and applications.
• Full-width opening door integrated two viewports with shutters for observing substrate and sputter sources.
• Full range vacuum gauge with display and Baratron gauge for closed-loop pressure control.
• Ultimate vacuum of chamber about 10^-8 Torr.

Options

• Intergrated with Load-Lock, robot arm, glove box.
• Combined with Ion-source, thermal source, E-beam, etc.
• RF or DC bias switching.
• Thickness monitor.
• Substrate RF plasma cleaning.
• Extra spare port for OES, RGA or extra process monitoring.