SYSKEY TECHNOLOGY Co., Ltd.

Multi-Layer Sputter

Multi-Layer Sputter
SYSKEY TECHNOLOGY Co., Ltd.

Multi-Layer Sputter

Excellent thin-film uniformity of less than ±3%.
 Substrate holder heating up to 600°C
 Shutters are installed each sputtering source and substrate

The high-quality multilayer films are becoming increasingly important in precision systems that single material thin film cannot practice the required specifications.

Applications

  • Intergrated with Load-Lock, robot arm, glove box.
  • Combined with Ion-source, Thermal source, E-beam, etc.
  • RF or DC bias switching.
  • Thickness monitor.
  • Substrate RF plasma cleaning.
  • Extra spare port for OES, RGA or extra process monitoring.

 

Configurations

  • Flexible substrate size up to 12 inch.
  • Excellent thin-film uniformity of less than ±3%.
  • Magnetron sputtering sources (up to 6 sources) with optional target sizes.
  • RF, DC or pulsed-DC for non-conductive or conductive target.
  • Deposition of multilayer films with selected target materials.
  • Mass flow controllers (up to 4 gas lines).
  • Substrate holder heating up to 600°C.
  • Adjustable substrate to target spacing.
  • Shutters are installed each sputtering source and substrate.

 

Chamber

  • Flexible chamber sizes depend on substrate size and applications.
  • Full-width opening door integrated two viewports with shutters for observing substrate and sputter sources.
  • Full range vacuum gauge with display and Baratron gauge for closed-loop pressure control.
  • Ultimate vacuum of chamber about 10-8 Torr.

 

Options

  • Intergrated with Load-Lock, robot arm, glove box.
  • Combined with Ion-source, thermal source, E-beam, etc.
  • RF or DC bias switching.
  • Thickness monitor.
  • Substrate RF plasma cleaning.
  • Extra spare port for OES, RGA or extra process monitoring.