Applications
- Shipping/receiving area: Wafer transfers are used to move incoming wafers from a shipping cassette to a WIP production cassette.
- Epitaxial area: Wafer transfers are used to move incoming wafers from a shipping cassette to a WIP production or specialty EPI process cassette.
- Wet chemistry areas: Wafer transfers are used to move wafers between a WIP production cassette to a wet process Teflon PFA cassette when they enter wet chemistry areas.
- Thermal process bake areas: Wafer transfers are used to move wafers between a WIP production cassette and metal or quartz cassettes when they enter thermal process bake process areas
- Metrology and inspection areas: Wafer transfers may also occur in metrology and inspection areas where wafers are analyzed and inspected for defects and other quality control measures.
- Probe and test areas: Wafer transfers are used to move incoming wafers from a shipping cassette to a WIP production cassette.
- Wafer Flipping/Inverting: Wafer transfers are used to move wafers from one cassette to another that has been inverted 180°. In semiconductor manufacturing, there are various processes that involve working on the backside of a wafer. These processes can include backside lithography, etching, deposition, and bonding, among others. To carry out these processes, the manufacturer needs to flip the wafer over so that the backside is facing up.
The T3 series is a precision manual horizontal bulk wafer slide transfer for safely transferring wafers between two SEMI compliant wafer cassettes. Compatible with high-profile plastic process, metal cassettes and most shipping cassettes with an H-BAR. Features a smooth, service-free slide rail system engineered with advanced coated rods paired with UHMW bearing blocks. Antistatic, abrasion and chemical resistant materials. ISO Class 4.
