Foam Cushion Disk 8" (200 mm)

Foam Cushion Disk 8" (200 mm)

Foam Cushion Disk 8" (200 mm)

Choose your size:
Shock Absorption during Transit
Wafer Edge Protection
Customized Wafer Packing
Manual Assembly Compatibility
Long-term Storage Solution
Semiconductor Shipping
Cleanroom Operations

8" (200mm) Foam Cushion Disk
ePAK description: eFD8-200-3-eM-04-H-PNK


  • Shock Absorption during Transit: Protects wafers from impacts and vibrations in transit.
  • Wafer Edge Protection: Cushions the delicate edges of wafers, preventing mechanical damage.
  • Customized Wafer Packing: Adaptable for various wafer sizes, ensuring a secure fit for different wafer types.
  • Manual Assembly Compatibility: Ideal for manual wafer packing processes, providing ease of use and precision placement.
  • Long-term Storage Solution: Offers a protective environment for wafers during extended storage periods.
  • Semiconductor Shipping: Ensures wafers stay intact and clean throughout the shipping process.
  • Cleanroom Operations: Suitable for use in cleanroom environments, maintaining wafer purity.

SPS's foam disks play an important role in their wafer jar assembly process, offering essential protection during wafer shipping. These foam disks, specifically designed for wafer cushions, provide a secure and stable environment for wafers of various diameters. Positioned at the bottom and top of the jar, they absorb shocks and vibrations, crucial for maintaining wafer integrity during transport.

This design highlights SPS's commitment to safe substrate handling, ensuring that wafers are securely cushioned against potential impacts. The foam disks are a key component in the manual wafer packing process. Their placement is strategically planned to maximize protection while accommodating wafers of different sizes. The adaptability of these foam disks to various wafer diameters showcases SPS's attention to detail and understanding of the diverse needs in wafer shipping.

This adaptability is crucial in customizing the packing process for different semiconductor shipping requirements, making the foam disks an indispensable element in wafer jar assembly. In summary, SPS's use of foam disks in wafer cushioning demonstrates their dedication to enhancing wafer shipping efficiency. These foam disks not only provide robust protection but also contribute to the overall practicality and reliability of the wafer shipping process. The careful design and placement of these foam disks underscore SPS's commitment to delivering high-quality solutions in the semiconductor transport industry.

Serie 4" (100mm) Wafer Jar

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4” (100mm) Black Carbon Separator Interleaf for use between individual wafers. The interleaf diameter is 100 mm and the separator thickness is 0.07 mm
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