Scratch reduction -Scratches on wafers can occur during handling and can result in defects and yield loss. Wafer presenters are designed to lift the wafer up from its cassette, allowing operators to access and handle the wafer without having to physically go between the wafers inside the cassette. This eliminates the need for operators to manually manipulate the wafer and reduces the risk of damage or contamination.
The WHS-P3-601 is a manual five-wafer lift presenter, designed for 150 mm (6”) diameter wafers. Note that the WHS-P3-601 is also compatible with 125 mm wafers. The WHS-P3 simultaneously lifts a five wafer set (set 1 = 1:6:11:16:21 ; set 2 = 2:7:12:17:22 ; etc.) of wafers to an operator for easy removal of a wafer without scratching neighboring wafers in the cassette. Constructed with antistatic materials, the WHS-P3-601 is built to meet the strict ISO 4 (FS209E Class 10) standards, ensuring the highest level of protection for your wafers.
