ESPRO® Megasonic Unit Array

ESPRO® Megasonic Unit Array

ESPRO® Megasonic Unit Array

High frequency, up to 1MHz
Ability to remove particles in 0.2 μm
Ultra-low cavitation effect, no damage to device surface
Significantly reduce the use of clean-ing fluid
No metal materials contact with liquid


  • Wafer cleaning
  • Mask Cleaning
  • CMP (chemical mechanical polishing)
  • Development
  • Etching
  • Photoresist stripping
  • Lift-off
  • Lens cleaning
  • Precision cleaning of display screen and other microelectronic industries

Cover type megasonic cleaning is an optimized meagsonic cleaning technology which has the advantages of both batch type and shower type megasonic cleaning and removes the drawbacks of both types. It can directly transfer the megason-ic energy with large area onto the substrate surface, has quite high uniformity of sound field as well as the transfer efficiency. Furthermore, cover type megasonic cleaning gives very high utilization of cleaning fluid.

Frequency: 1MHz
Max. Intensity: 2W/cm2
Housing Material: PEEK
Resonator Material: Quartz, Sapphire
Flow Rate: 0.5-3.0L/min
Nitrogen or CDA purge: 10L/min
Applicable Wafer: 4”, 6”, 8”, 12”
Ambient Temperature: <70 °C


  • Directly cover on the surface of the object to be cleaned with a small gap, providing higher energy conversion efficiency
  • Greatly reduce the use of cleaning fluid
  • Extremely low ultrasonic cavitation effect, no damage to device surface
  • No secondary pollution of cleaning fluid
  • Ultra-high cleaning precision, which can remove 0.2 micron particles on the object surface
  • Made of non-metallic high anti-corrosion materials, suitable for various acid-base and organic solvents
  • Quartz or sapphire matching layer technology, no risk of impurities falling off the device
  • Unique transducer bonding technology provides higher stability and durability
  • Megasonic generator using the third-generation semiconductor technology, fully realizing digital high-frequency and high-power drive