ePAK

EPAD® Thermal Formed Wafer Cushion 8" (200 mm)

EPAD® Thermal Formed Wafer Cushion 8" (200 mm)
ePAK

EPAD® Thermal Formed Wafer Cushion 8" (200 mm)

Choose your size:

8" (200 mm) ePAD® Wafer Cushion

ePAD™ thermal formed wafer cushions – Particle free, vacuum formed, cushioning material for wafer stack

Specifications:

  • ePAK description: eWP8-200-3-eM-20-BLK
  • For 8" (200 mm) substrates
  • Material Proprietary conductive PS
  • Available for 6”, 8” and 12” wafer sizes