ePAK
EPAD® Thermal Formed Wafer Cushion 8" (200 mm)
ePAK
EPAD® Thermal Formed Wafer Cushion 8" (200 mm)
Choose your size:
8" (200 mm) ePAD® Wafer Cushion
ePAD™ thermal formed wafer cushions – Particle free, vacuum formed, cushioning material for wafer stack
Specifications:
- ePAK description: eWP8-200-3-eM-20-BLK
- For 8" (200 mm) substrates
- Material Proprietary conductive PS
- Available for 6”, 8” and 12” wafer sizes
Brand
ePAK
Product Number
eVT0209-eM-20-BLK
Material
Proprietary Conductive PS | eM-20-BLK
Sizes
200 mm (8")
Thickness
3 mm
Diameter
200 mm
Status
Request information