DS&HIVE

DS&HIVE

Number: DS&HIVE
Price on quote
Quantity

Specifications

Number
DS&HIVE
TAG 1
4,25"
TAG 2
CMP Process ILD, CMP Process STI, CMP Process Metal, CMP Process Buffing, CMP Process Barrier, CMP Process Poly, CMP Process Gate
TAG 3
SST - Diamond-Nickel Bonding
Brand
SAESOL

Documentation

CMP Pad Conditioners SPS-Europe Sheet
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Product description

DS&HIVE PAD CONDITIONER

Pad-refreshing consumable for removal of polyurethane pad surface clogging
4.25" (Stainless Steel, Diamond-Nickel Bonding)

Our CMP Pad Conditioners have been tested and proven in production by major semiconductor manufactures in USA, Europe, Taiwan and Korea. We have the capability to meet the needs of each customer by providing customized disks. Our CMP disks are available in various production quantities, shapes and sizes for all CMP production platforms.

Application:

 

  • Semiconductor CMP process (ILD, STI, Metal, Buffing, Barrier, Poly, Gate)


Features

 

 

  • Stable Pad Roughness
  • Long conditioner life time
  • Long pad life time
  • Small debris size& Amount