SYSKEY TECHNOLOGY Co., Ltd.

Co-Sputter

Co-Sputter
SYSKEY TECHNOLOGY Co., Ltd.

Co-Sputter

Flexible substrate size up to 12 inch
 Substrate holder heating up to 1000°C
 Multiple sources with sequential operation or co-deposition

Co-sputtering is simultaneous coating from two or multiple sputtering targets. It is used for compound - alloy or composite material.

Applications

  • Semiconductors .
  • Nanotechnology.
  • Product QC & QA.
  • Oxide, Nitride and Metal.
  • Materials research.
  • Solar-cell.
  • Optical Research.
  • Materials Research.

 

Configurations

  • Flexible substrate size up to 12 inch.
  • Excellent thin-film uniformity of less than ±3%.
  • Magnetron sputtering sources (up to 8 sources) with optional target sizes.
  • Multiple sources with sequential operation or co-deposition.
  • RF, DC or pulsed-DC for non-conductive or conductive target.
  • Deposition of multilayer films with selected target materials.
  • Mass flow controllers (up to 4 gas lines).
  • Substrate holder heating up to 1000°C.
  • Adjustable substrate to target spacing.
  • Shutters are installed each sputtering source and substrate.

 

Chamber

  • Flexible chamber sizes depend on substrate size and applications.
  • Full-width opening door integrated two viewports with shutters for observing substrate and sputter sources.
  • Full range vacuum gauge with display and Baratron gauge for closed-loop pressure control.
  • Ultimate vacuum of chamber about 10-8 Torr.

 

Options

  • Intergrated with Load-Lock, robot arm, glove box.
  • Combined with Ion-source, thermal source, E-beam, etc.
  • Substrate RF or DC bias.
  • Thickness monitor.
  • Substrate RF plasma cleaning.
  • Extra spare port for OES, RGA or extra    
  • process monitoring.