TBP
Vertical Wafer Transfer - Single/Mass 8" (200mm)
TBP
Vertical Wafer Transfer - Single/Mass 8" (200mm)
Choose your size:
8" (200mm) Vertical Wafer Transfer - Single/Mass
Model: SWTS8
The SWTS-Series is designed for automatic wafer transfer. With this system it is possible to split, merge, sort, compress wafer-lots, or create individual wafer-mix as desired. The system is equipped with two load-ports and mechanical wafer notch/flat-aligners. The waferhandling is realized via edge gripping, so no vacuum is required. The system is equipped also with a automatic Mass Wafer Gripper to transfer a whole batch.
Specifications:
- For 8" (200mm) Wafers
- Wafer Thickness: 450um - 750um
- Single and Mass Transfer Capabilities
- No Vacuum Needed (Edge Gripping)
- Vertical Transfer System
- Cross Slotted Wafer Detection
- Tabletop System or With Stand
- Throughput up to 700 wph
- Windows Operating System
- ESD-Safe
- RFID Cassette Identification on Request
- Upgrade to Wafer Identification Possible
- Full SECS/GEM Compliance
Applications:
- Wafer Transfer
- Compress to Top by Slot
- Compress to Bottom by Slot
- Invert by Slot
- Individual Transfer-Function to progam custom recipes
*** Note: Please specify cassette model numbers when ordering ***
Contact SPS-Europe for special requests!
Brand
TBP
Product Number
SWTS8
Wafer size
8" (200mm)
System
Automatic System
Slots
Single & Mass Transfer
Status
Request information