TBP

Vertical Wafer Transfer - Single/Mass 8" (200mm)

Vertical Wafer Transfer - Single/Mass 8" (200mm)
TBP

Vertical Wafer Transfer - Single/Mass 8" (200mm)

Choose your size:

8" (200mm) Vertical Wafer Transfer - Single/Mass

Model: SWTS8

The SWTS-Series is designed for automatic wafer transfer. With this system it is possible to split, merge, sort, compress wafer-lots, or create individual wafer-mix as desired. The system is equipped with two load-ports and mechanical wafer notch/flat-aligners. The waferhandling is realized via edge gripping, so no vacuum is required. The system is equipped also with a automatic Mass Wafer Gripper to transfer a whole batch.

Specifications:

 

  • For 8" (200mm) Wafers
  • Wafer Thickness: 450um - 750um
  • Single and Mass Transfer Capabilities
  • No Vacuum Needed (Edge Gripping)
  • Vertical Transfer System
  • Cross Slotted Wafer Detection
  • Tabletop System or With Stand
  • Throughput up to 700 wph
  • Windows Operating System
  • ESD-Safe
  • RFID Cassette Identification on Request
  • Upgrade to Wafer Identification Possible
  • Full SECS/GEM Compliance


Applications:

 

 

  • Wafer Transfer
  • Compress to Top by Slot
  • Compress to Bottom by Slot
  • Invert by Slot
  • Individual Transfer-Function to progam custom recipes


*** Note: Please specify cassette model numbers when ordering ***

Contact SPS-Europe for special requests!