ePAD™ wafer platforms – Provides the flat surface required for the proper function of the ePAD system and is a High performance alternative to foam-based solutions
Specifications:
ePAK description: eFP6-150-0.8-eM-20-BLK-(P1)
For 6" (150mm) substrates
Material Proprietary conductive PS
Diameter: 150 mm
Thickness: 0,8 mm
Cleanroom bagged per 50 pieces (P1) / 400 pcs per carton
