ePAD™ thermal formed wafer cushions – Particle free, vacuum formed, cushioning material for wafer stack
Specifications:
- ePAK description: eWP6-150-5-eM-20-BLK
- For 6" (150mm) substrates
- Material: Propietary conductive PS
- Diameter: 150 mm
- Thickness: 5 mm
- Particle-free vacuum formed cushioning
Cleanroom bagged per 10 pieces (P2)
ePAD®
High performance alternative to foam-based solutions
- Made from proprietary, low-ionic, flexible, conductive polystyrene
- Ideal for both Cu and Al metallized wafers
- Best choice for both long and short term storage needs
- Available for 6”, 8” and 12” wafer sizes
