ePAK

EPAD® Thermal Formed Wafer Cushion 12" (300 mm)

EPAD® Thermal Formed Wafer Cushion 12" (300 mm)

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ePAK

EPAD® Thermal Formed Wafer Cushion 12" (300 mm)

Choose your size:

12" (300 mm) ePAD® Wafer Cushion
ePAK code: eWP12-300-5-eM-20-BLK

ePAD™ thermal formed wafer cushions – Particle free, vacuum formed, cushioning material for wafer stack

Specifications:

  • Material: Proprietary Conductive PS
  • Diameter: 300 mm
  • Thickness: 5 mm
  • Particle-free vacuum formed cushioning