6" PE-CVD System (Plasma Enhanced)

6" PE-CVD System (Plasma Enhanced)

Number: S-PE-CVD-6
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Specifications

Number
S-PE-CVD-6
TAG 1
Up to 6" (150mm)
TAG 2
Fully Automatic
TAG 3
< 3% Uniformity
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Product description

6" PE-CVD System (Plasma Enhanced)

PE-CVD system is a single process chamber CVD system using advanced plasma technology. It is designed to be compliant with SEMI and ISO standards for 6 inch semiconductor wafer processing, especially suitable for the deposition of silicon oxide and silicon nitride thin films. The system is configured with a parallel-plate capacitor type plasma reactor, a high quality vacuum system, and an integrated electronic control system for fully automatic process control.

General Specifications:
  • Customized solutions adopted to your needs
  • Flexible design
  • From lab to fab equipment
  • Cost efficient design