PE-CVD system is a single process chamber CVD system using advanced plasma technology. It is designed to be compliant with SEMI and ISO standards for 6 inch semiconductor wafer processing, especially suitable for the deposition of silicon oxide and silicon nitride thin films. The system is configured with a parallel-plate capacitor type plasma reactor, a high quality vacuum system, and an integrated electronic control system for fully automatic process control.
General Specifications:
- Customized solutions adopted to your needs
- Flexible design
- From lab to fab equipment
- Cost efficient design
