Semiconductor equipment
Prevent wafer scrapping?
Can you detect tool deterioration on time?
✔ Diagnostic for tool integration ✔ Monitor trends of vibration conditions ✔ Detect dynamic problems
VS-Series Vibration Sensors Provide advanced warning when machine conditions are deteriorating, allowing engineers to take preventive action and avoid failure and losses.
- Measuring 3 axis (X, Y, Z)
- High output data >800 measurements/sec
- Simple and convenient USB plug-n-use operation
- Seamless integration via SECS / GEM
- Tool integration or mobile use, on/off-line monitoring
CMP Tool
Pad conditioner (PC) arm vibration behaviour
The VS-1TM was used to detect the vibration of the Pad Conditioner arm. The yellow arrow Y indicates the sweeping movement of the PC Arm.
Readings show Z-axis vibration to be high at the centre of the pad. Follow-up investigation found that the High Pressure Rinse DIW nozzle spray was weak at the pad centre area. This will lead to low cleaning efficiency at pad centre area and induce pad glazing and microscratch issu
SEM images of pore-type pad surface and glazed surface of the same pad.
Data logged by VS-1 @ 800Hz
Robot handling - Data logged by VS-1
Robot handling
FI robot wafer retrieval motion
1. FI robot moving to ready position (pick up slot position) (Z-axis motion)
2. Robot blade extends into FOUP (X-axis motion. Plunger will retract during start of this step)
3. Robot blade picks up the wafer (Z-axis motion, wafer lifted up from the slot and plunger extends to hold the wafer)
4. Robot blade retracts from FOUP (X-axis motion, wafer retrieval action completed)
